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Aries Electronics, incorporated in 1972, began when the late William "Bill" Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill's vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for "intelligent connectors" (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
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ContactResistance: - standardLeadTime: 4 Weeks ContactMaterial-Mating: Beryllium Copper CurrentRating(Amps): 3 A Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled ContactFinish-Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Material Flammability Rating: UL94 V-0 Product Status: Active Pitch-Mating: 0.100 (2.54mm) ContactFinishThickness-Mating: 10.0µin (0.25µm) Operating Temperature: - Contact Material - Post: Brass HousingMaterial: Polyamide (PA46), Nylon 4/6, Glass Filled OperatingTemperature: - MoistureSensitivityLevel(MSL): 1 (Unlimited) ECCN: EAR99 rolledUpProductNumber: A407-ND MountingType: Through Hole Mounting Type: Through Hole Number of Positions or Pins (Grid): 24 (2 x 12) TerminationPostLength: 0.125 (3.18mm) detailedDescription: 24 (2 x 12) Pos DIP, 0.4 (10.16mm) Row Spacing Socket Gold Through Hole datasheetUrl: //mm.digikey.com/Volume0/opasdata/d220001/medias/docus/997/518_Series.pdf manufacturerUrl: /en/supplier-centers/aries-electronics Contact Material - Mating: Beryllium Copper Termination Post Length: 0.125 (3.18mm) Package: Bulk HTSUS: 8536.69.4040 lnkProductPhoto: https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/1103/24-4518-10.jpg MaterialFlammabilityRating: UL94 V-0 Category: Connectors, InterconnectsSockets for ICs, TransistorsIC Sockets ContactFinish-Mating: Gold Current Rating (Amps): 3 A description: CONN IC DIP SOCKET 24POS GOLD manufacturer: Aries Electronics manufacturerProductNumber: 24-4518-10 Pitch - Post: 0.100 (2.54mm) BaseProductNumber: 24-4518 ContactMaterial-Post: Brass Mfr: Aries Electronics Features: Open Frame Pitch - Mating: 0.100 (2.54mm) Contact Resistance: - Contact Finish - Mating: Gold Pitch-Post: 0.100 (2.54mm) isNormallyStocking: True RoHSStatus: ROHS3 Compliant NumberofPositionsorPins(Grid): 24 (2 x 12) ContactFinishThickness-Post: 200.0µin (5.08µm) ProductStatus: Active Termination: Solder REACHStatus: REACH Unaffected Contact Finish Thickness - Post: 200.0µin (5.08µm) Series: 518 Type: DIP, 0.4 (10.16mm) Row Spacing Contact Finish - Post: Tin rolledUpProductId: 44013 Base Product Number: 24-4518